Resideo appoints new president of products & solutions

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Sach Sankpal has been named as president of Resideo’s Products & Solutions business, effective Jan. 7, 2020. Sankpal is a proven leader with a successful track record of driving growth, operational excellence and strategic transformation at global industrial and technology companies. He brings more than 25 years of experience across strategy, marketing, finance, operations and sales.

Sankpal most recently served as senior vice president for Emerging Industries at Trimble, Inc., a $3 billion in revenue company specialising in hardware and software for global industrial companies. During his tenure, Sankpal drove company-wide strategies for product innovation, pricing, product management, sales innovation and deployment as well as a new management operating system to support the company’s multiple business lines.

Prior to Trimble, Sankpal served in various leadership, strategy and operations roles at Avaya, Inc. and Navigant Consulting. He also served as president of Honeywell Global Safety Products, a $2 billion in revenue business, where he led a recovery in the segment by driving operational excellence in delivery and productivity, transforming the company’s research and development program and enhancing its product roadmap.

“We are delighted to welcome Sach to Resideo,” said Andy Teich, the company’s lead independent director and chair of its Strategic and Operational Committee. “Given his deep leadership experience and operational expertise, Sach is ideally positioned to lead the Products & Solutions business as we transform Resideo into a more profitable, efficient company. He will play a critical role executing the recommendations of our ongoing operational and financial review as we work to drive long-term success and enhance shareholder value.”

Niccolo de Masi, who previously served as Resideo’s Products & Solutions president, chief innovation officer and board member, will remain as chief innovation officer but will resign his role as board member.